Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Patent
1997-02-13
1998-06-09
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With stress relief
257670, 257667, H01L 23495
Patent
active
057639426
ABSTRACT:
There is provided a lead frame including an outer frame, a die pad on which a semiconductor device is to be mounted, a plurality of outer leads extending from the outer frame to the die pad, a dam bar connected at opposite ends thereof to the outer frame for connecting the outer leads to one another for prevention of resin overflow, and a support lead extending obliquely to the dam bar for connecting the die pad to the outer frame. The outer frame is formed beyond an end of the dam bar with an opening extending in a direction making an angle with a direction in which the dam bar longitudinally extends so that there is formed an elastically deformable portion between the opening and an end of the dam bar, the opening having a length covering at least a width of the dam bar. When there is generated a stress because of shrinkage of resin with which a semiconductor device is sealed, the elastically deformable portion is first deformed by absorbing a stress to thereby prevent the stress from spreading further to the dam bar. Thus, it is possible to prevent irregular bending of outer leads connected by the dam bar with each other. As a result, higher accuracy is expected with respect to a position of outer leads after a semiconductor device is sealed with resin.
REFERENCES:
patent: 5223738 (1993-06-01), Okada
patent: 5293064 (1994-03-01), Yoshimoto et al.
patent: 5309010 (1994-05-01), Shibata et al.
patent: 5541447 (1996-07-01), Maejima et al.
patent: 5554885 (1996-09-01), Yamasaki et al.
Clark S. V.
NEC Corporation
Saadat Mahshid D.
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