Method of bonding metals, and method and apparatus for producing

Details Method of bonding metals, and method and apparatus for producing Method of bonding metals, and method and apparatus for producing

1991-12-23

1993-02-23

Ramsey, Kenneth J.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228124, 2281802, 228219, 228205, H01L 2170, B23K 120

Patent

active

051882809

ABSTRACT:
A technique for producing a chip mount type package or a TAB package with high reliability, without use of a flux which would cause environmental pollution or would hinder an enhancement of reliability, more particularly pertains to a method of irradiating bonding surfaces, for which a solder is used, and solder bump electrodes of a package with an atomic or ion energy beam, and bonding the bonding surfaces to each other under normal pressure (about 1 atm) in a continuous apparatus.

REFERENCES:
patent: 4379218 (1983-04-01), Grebe et al.
patent: 4558812 (1985-12-01), Bailey et al.
patent: 4865245 (1989-09-01), Schulte et al.
patent: 5000819 (1991-03-01), Pedder et al.
patent: 5090609 (1992-02-01), Nakao et al.

Affiliated with

Also associated with

Rating

Method of bonding metals, and method and apparatus for producing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of bonding metals, and method and apparatus for producing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of bonding metals, and method and apparatus for producing will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2199353