Method of coupling between an optical fiber and an optoelectroni

Details Method of coupling between an optical fiber and an optoelectroni Method of coupling between an optical fiber and an optoelectroni

1980-10-02

1982-04-27

Weisstuch, Aaron

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156644, 29572, 29580, 29588, 29589, 250227, 350 9615, 350 9617, G02B 514, H01L 3118

Patent

active

043267718

ABSTRACT:
A method of optical coupling between an optical fiber and an optoelectronic component for an optical-fiber telecommunications link is applied to the fabrication of a transmitting and/or receiving optoelectronic head. In a semiconductor wafer having a p.sup.- layer and a p.sup.+ layer, chemical etching of the p.sup.- layer is followed by n-type doping of an n.sup.+ layer at the bottom of the cavity and on the edge of the cavity. Highly accurate positioning of the optical fiber is thus ensured as well as excellent coupling between the fiber and the light-emitting diode or photodiode thus provided.

REFERENCES:
patent: 4192574 (1980-03-01), Henry et al.
patent: 4227975 (1980-10-01), Hartman et al.

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