Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

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Details

257666, 257690, 257692, 257784, 257786, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

054422310

ABSTRACT:
A semiconductor device capable of accommodating a larger semiconductor chip in its package than a comparable conventional device and providing flexibility in the design of the semiconductor chip. An insulating tape includes an opening which receives a plurality of electrode pads disposed on the central part of the top surface of the semiconductor chip. The insulating tape is disposed between the semiconductor chip and inner leads of a lead frame. Circuit pattern traces are present on top of the insulating tape. The inner end of each circuit pattern trace is connected to a corresponding electrode pad with a fine metallic wire, and the outer end of each circuit pattern trace is connected to the corresponding inner lead.

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