Process of fabrication planarized metallurgy structure for a sem

Details Process of fabrication planarized metallurgy structure for a sem Process of fabrication planarized metallurgy structure for a sem

Filed on

1994-03-18

Date issued

1995-08-15

Examiner

Quach, T. N.

Patent Class

Fishing, trapping, and vermin destroying

Other Related Categories

437 50, 437228, 257211, H01L 21283

Type

Patent

Status

active

Patent number

054419158

Description

ABSTRACT:
A method for fabricating a metallurgy system is described wherein a first level of metallurgy is formed, having a plurality of close uniformly spaced conductive line of a predetermined width, and wherein there are included larger gaps between the conductive lines. The areas in the larger gaps are filled with dummy lines, where the gap is equal to or greater than three times the feature size or alternatively the width of the conductive lines.

REFERENCES:
patent: 4972580 (1990-11-01), Nakamura
patent: 5027188 (1991-06-01), Owada et al.
patent: 5032890 (1991-07-01), Ushiku et al.
patent: 5066997 (1991-11-01), Sakurai et al.
patent: 5077234 (1991-12-01), Scoopo et al.
patent: 5103282 (1992-04-01), Isomura et al.
patent: 5182235 (1993-01-01), Eguchi
Korczynski, E., et al., "Improved Submicron Inter-Metal . . . " Microelectronics Manufacturing Technology, Jan. 1992, pp. 22-27.

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