Multi-step chemical vapor deposition method for thin film transi

Coating processes – Coating by vapor – gas – or smoke – Plural coatings applied by vapor – gas – or smoke

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

4272481, 427255, 427578, 427579, 427402, 437101, 437909, C23C 1622

Patent

active

054417686

ABSTRACT:
An improved method of depositing films of a gate silicon nitride and an amorphous silicon on a thin film transistor substrate at high deposition rates while maintaining superior film quality is provided. The material near the interface between the amorphous silicon and the nitride are deposited at a low deposition rate which produces superior quality films. The region away from the interface are deposited at a high deposition rate which produces lesser, but still good quality films. By using this method, superior quality thin film transistors can be produced at very high efficiency. The method can be carried out by depositing a high quality g-SiN.sub.x at a low deposition rate on top of an average quality gate nitride deposited at a high deposition rate and then depositing an amorphous silicon layer. It also applies in a process where high quality amorphous silicon is first deposited at a low deposition rate on a gate nitride layer to form an interface, and then average quality amorphous silicon is deposited at a high deposition rate to complete the silicon layer. The unique process can be applied whenever an interface exists with an active semiconductor layer of amorphous silicon. The process is applicable to either the back channel etched TFT device or the etch stopped TFT device.

REFERENCES:
patent: 5273920 (1993-12-01), Kwasnick et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Multi-step chemical vapor deposition method for thin film transi does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi-step chemical vapor deposition method for thin film transi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-step chemical vapor deposition method for thin film transi will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2180457

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.