Plug plating

Chemistry: electrical and wave energy – Processes and products

Patent

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Details

204 24, 204 38B, C25D 502, C25D 704

Patent

active

042785111

ABSTRACT:
Method for producing fine line circuit boards utilizing both sides thereof, with through-hole plating wherein the board is drilled and conductive metal clad, the surface is passivated and the holes and the surfaces are electroplated to a desired thickness. Thereafter the surface electroplate is peeled off the board, leaving the plating in the holes. Subsequently the board is masked in a desired pattern, etched to remove the cladding and form a circuit, and then the mask is removed and solder is applied to the plated holes.

REFERENCES:
patent: 2699425 (1955-01-01), Nieter
patent: 2872391 (1959-02-01), Hauser
patent: 3143484 (1964-08-01), Olin
patent: 3171796 (1965-03-01), Stephens
patent: 3370351 (1968-02-01), Freehauf
patent: 3566005 (1971-02-01), Shaheen
patent: 3606677 (1971-09-01), Ryan
patent: 3673680 (1972-07-01), Tanaka
patent: 3855692 (1974-12-01), Dugan
patent: 3969815 (1976-07-01), Hacke
patent: 4104111 (1978-08-01), Mack

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