Wafer scale multi-chip module

Details Wafer scale multi-chip module Wafer scale multi-chip module

1994-02-01

1995-05-23

LeDynh, Bot

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361709, 361715, 361720, 257707, 257713, 174260, H05K 118, H05K 100

Patent

active

054186870

ABSTRACT:
A wafer scale multi-chip semiconductor module used to interconnect and house a plurality of integrated circuit chips. The wafer scale multi-chip semiconductor module has an interconnect network extending between the integrated circuit chips along the substrate of the semiconductor wafer module, which allows electrical access to the integrated circuit chips by means of electrically conductive bridge connections. The integrated circuit chips are placed in openings in the semiconductor wafer module, allowing for excellent planarity.

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