Exposure method

Radiation imagery chemistry: process – composition – or product th – Registration or layout process other than color proofing

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430397, 355 53, 355 77, 356399, G03F 900

Patent

active

054439329

ABSTRACT:
An exposure method includes disposing a mask and a semiconductor wafer opposed to each other in a close proximity relation with respect to a Z-axis direction and printing a pattern of the mask on each of different shot areas of the semiconductor wafer in a step-and-repeat manner, with a predetermined exposure energy. In this method, the spacing between the mask and the wafer for the paralleling of them is made larger than the spacing therebetween as assumed at the time of mask-to-wafer alignment with respect to X-Y plane or the spacing between the mask and the wafer as assumed at the time of exposure of the wafer to the mask. After the paralleling of the mask and the wafer, the mask and the wafer are moved closer to each other in the Z-axis direction and alignment and exposure is performed. This ensures that the alignment and exposure are effected at an optimum spacing while, on the other hand, contact of the mask and the wafer at the time of paralleling is precluded.

REFERENCES:
patent: 4623608 (1986-11-01), Andrevski
patent: 4669868 (1987-06-01), Chapelle et al.
patent: 4676630 (1987-06-01), Matsushita et al.
patent: 4748477 (1988-05-01), Isohata et al.
patent: 4864360 (1989-09-01), Isohata et al.
patent: 4870668 (1989-09-01), Frankel et al.
patent: 4891526 (1990-01-01), Reeds
patent: 4998134 (1991-03-01), Isohata et al.

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