Semiconductor device with metal base substrate having hollows

Details Semiconductor device with metal base substrate having hollows Semiconductor device with metal base substrate having hollows

1998-05-29

1999-11-02

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257778, 257779, H01L 2348

Patent

active

059776331

ABSTRACT:
In the manufacture of a semiconductor device, an insulator film is attached to the back surface of a metal base substrate, and over the insulator film a wiring pattern is formed. A silicon chip is loaded on the metal base substrate via a mount and is connected to the wiring pattern via bonding wires. Solder pads or bump contacts are formed on the wiring pattern; the metal base substrate is locally cut out at areas just above the solder bump contacts to form hollows. Finally the resulting wiring pattern is covered with a cover insulator film and the silicon chip is sealed with seal resin.

REFERENCES:
patent: 5668405 (1997-09-01), Yamashita
patent: 5835355 (1998-10-01), Dordi
H. Asakura, "Packaging Technology", Nikkei Microdevice, Jun. 1995, pp. 61-65.
"Area Array Packaging Seminar", TechSearch International, Inc., Dec. 1, 1995.
B. Levine et al., "The Package", Electronic News, Jan. 22, 1996, p. 48.

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