Semiconductor device mounted in resin sealed container

Details Semiconductor device mounted in resin sealed container Semiconductor device mounted in resin sealed container

1993-12-17

1999-11-02

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Entirely of metal except for feedthrough

257704, H01L 2302

Patent

active

059776285

ABSTRACT:
A plastic-molded hollow semiconductor device includes a base and a cover joined together by a thermosetting resin bonding material applied to the entire edge surfaces of the cover as well as bonding surfaces of the base and the cover. The thermosetting resin bonding material is applied after placing the cover on the base and simultaneously pre-heating them, whereby the gas trapped between the base and the cover is prevented from expanding, so that through-holes are eliminated, thereby making it possible to obtain a semiconductor device which provides a high level of handling property and reliability.

REFERENCES:
patent: 4159221 (1979-06-01), Schuessler
patent: 5064968 (1991-11-01), Kovacs et al.
patent: 5117281 (1992-05-01), Katsuraoka
patent: 5343076 (1994-08-01), Katayama et al.

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