Method for arranging minute metallic balls

Details Method for arranging minute metallic balls Method for arranging minute metallic balls

1998-06-17

1999-11-02

Chaudhuri, Olik

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

257738, 22818022, 228246, H01L 21607

Patent

active

059769653

ABSTRACT:
A method for arranging metallic balls to form an array of bump electrodes comprises the steps of immersing a silicon template in ethanol dropping metallic balls through the ethanol onto the template to receive the metallic balls in the holes of the template. The metallic balls are free from cohesion caused by electrostatic charge or moisture. The template may be inclined in the ethanol. The holes are formed by anisotropic etching a silicon plate.

REFERENCES:
patent: 3251600 (1966-05-01), Warnberg
patent: 5601229 (1997-02-01), Nakazato et al.
patent: 5722579 (1998-03-01), Yu et al.
patent: 5750199 (1998-05-01), Sakemi
patent: 5888850 (1999-03-01), Havens et al.

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