Polishing pad with incompressible, highly soluble particles for

Details Polishing pad with incompressible, highly soluble particles for Polishing pad with incompressible, highly soluble particles for

1999-01-13

1999-11-02

Codd, Bernard

Abrading

Flexible-member tool, per se

Laminate

451526, 451532, 522 90, 522 94, 524 41, 524 46, 524423, 524425, 524428, 524429, B24D 1700

Patent

active

059760001

ABSTRACT:
A hard polishing pad with a porous surface for use in chemical-mechanical planarization of semiconductor wafers. The polishing pad has a body with a planarizing surface upon which a slurry may be deposited, and a plurality of particles are suspended in the body. The body is made from a continuous phase matrix material, and the particles are made from a substantially incompressible material that is soluble in the slurry. As a wafer is planarized, the particles at the planarizing surface of the polishing pad dissolve in the slurry and create pores in the pad. Also, because the particles are substantially incompressible, they reinforce the pad to provide a hard, substantially incompressible pad.

REFERENCES:
patent: 3737400 (1973-06-01), Kumasaka et al.
patent: 4222926 (1980-09-01), Mizuno et al.
patent: 4908161 (1990-03-01), Ashida
patent: 5308438 (1994-05-01), Cote et al.
patent: 5401798 (1995-03-01), Rasp et al.
patent: 5476416 (1995-12-01), Kodate
patent: 5533923 (1996-07-01), Shamovilian et al.

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