Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1987-08-19
1989-12-12
Lacey, David L.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
1566591, 1566611, 156668, 437203, 437944, H01L 2128
Patent
active
048865737
ABSTRACT:
In a process for forming a wiring conductor of Cu, Al, Au or the like on a wiring substrate, polyimide-based resin having the following unit structural formula is used as a lift-off material. ##STR1## wherein R.sub.1 : ##STR2## R.sub.2 : ##STR3## n is an integer of 15,000 to 30,000. This lift-off material has very good etching susceptibility and can be selectively lifted off with an etching solution of a mixture of hydrazine and ethylene diamine from a lower polyimide layer having R.sub.1 : ##STR4## R.sub.2 : ##STR5## .
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Milgram, "Lift-Off Process for Achieving Fine-Line Metallization", J. Vac. Sci. Technol. B, vol. 1, No. 2, Apr.-Jun. 1983, pp. 490-493.
Frary et al., "Lift-Off Techniques for Fine Line Metal Patterning", Semiconductor International, Dec. 1981, pp. 72-89.
Miura Osamu
Miyazaki Kunio
Numata Shun-ichi
Otsuka Kanji
Watanabe Hiroshi
Anderson Andrew J.
Hitachi , Ltd.
Lacey David L.
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