Semiconductor device having particular power distribution interc

Details Semiconductor device having particular power distribution interc Semiconductor device having particular power distribution interc

1992-10-15

1994-05-03

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257666, 257698, H01L 3902, H01L 2358, H01L 2312, H01L 2348

Patent

active

053090217

ABSTRACT:
A semiconductor device according to the present invention has reduced inductance on a power supply line, a grounding line, and signal lines. In this invention, to reduce the length of the power supply connection and that of the grounding connection, a power supply metal post and a grounding metal post are respectively provided on a power supply lead of a semiconductor chip and grounding lead of the semiconductor chip perpendicular to the leads. The metal posts protrude from the resin encapsulating the chip and are connected to lands or a conductive circuit pattern on a printed circuit board. Furthermore, a planar conductor commonly connecting the power supply or grounding potentials is provided.

REFERENCES:
patent: 4612504 (1986-09-01), Moyer
patent: 4812949 (1989-03-01), Fontan et al.
patent: 4949158 (1990-08-01), Ueda
patent: 5016084 (1991-05-01), Nakao
patent: 5057805 (1991-10-01), Kadowaki

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