Endpoint detection apparatus and method for chemical/mechanical

Details Endpoint detection apparatus and method for chemical/mechanical Endpoint detection apparatus and method for chemical/mechanical

1992-01-30

1994-05-03

Hearn, Brian E.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156627, 437228, 151281R, 151283R, 151307, H01L 21304

Patent

active

053084381

ABSTRACT:
An apparatus and method for determining a selected endpoint in the polishing of layers on a workpiece in a chemical/mechanical polishing apparatus where the workpiece is rotated by a motor against a polishing pad. When a difficult to polish layer, i.e., one requiring a chemical change in a surface skin of the layer which skin is then abraded away by a mechanical process is removed from a more easy to polish surface, i.e., one that relies solely on mechanical abrasion and does not need to have a chemically converted skin thereon. The power required to maintain a set rotational speed in a motor rotating the workpiece significantly drops when the difficult to polish layer is removed. This current drop is used to detect the point at which the polishing must be stopped to avoid over polishing effects, i.e., dishing or thinning or removal of the more easily removed underlying material. Thus, an end point in the process can be established.

REFERENCES:
patent: 3874959 (1975-04-01), Hoekstra et al.
patent: 4193226 (1980-03-01), Gill, Jr. et al.
patent: 4207137 (1980-06-01), Tretola
patent: 4602981 (1986-07-01), Chen
patent: 4793895 (1988-12-01), Kaanta et al.
patent: 4910155 (1990-03-01), Cote et al.
patent: 4992135 (1991-02-01), Doan et al.
patent: 5036015 (1991-07-01), Sandhu et al.
patent: 5081421 (1992-01-01), Miller et al.
patent: 5084071 (1992-01-01), Nenadic et al.
patent: 5132617 (1992-07-01), Leach et al.
"End Point Detector for Chemi-Mechanical Polisher", IBM Technical Disclosure Bulletin, vol. 31, No. 4, Sep. 1988, pp. 325-326.
"Analyzing the Components of Chemo-Mechanical Polishing", Surfacetech Review, vol. 1, issue 5, Oct. 1988 pp. 1-4.
S. Wolf, Silicon Processing for the VLSI Era, vol. 2, Lattice Press, Sunset Beach, 1990, pp. 247-251.
"Spinning Etchant Polishes Flat, Fast," Electronics, vol. 55, No. 1, Jan. 13, 1982, pp. 40-1.

Affiliated with

Also associated with

Rating

Endpoint detection apparatus and method for chemical/mechanical does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Endpoint detection apparatus and method for chemical/mechanical , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Endpoint detection apparatus and method for chemical/mechanical will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2112246