Integrated circuits having patterns of mirror images and package

Details Integrated circuits having patterns of mirror images and package Integrated circuits having patterns of mirror images and package

1996-09-25

1997-11-25

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

254 48, 254724, 254784, 254786, H01L 2348, H01L 2358

Patent

active

056915705

ABSTRACT:
Normal and reverse IC patterns are each a mirror image of the other. The normal and reverse IC patterns are simultaneously formed on a semiconductor wafer and are simultaneously tested. The wafer with these IC patterns is cut into chips, which are packaged. The normal and reverse IC packages show identical parasitic impedance and uniform performance.

REFERENCES:
patent: 5165067 (1992-11-01), Wakefield et al.
patent: 5285082 (1994-02-01), Axer
patent: 5473198 (1995-12-01), Hagiya et al.

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