Semiconductor device including upper, lower and side oxidation-r

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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257409, 257410, H01L 2976, H01L 2994, H01L 31062, H01L 31113

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active

061246190

ABSTRACT:
In order to improve isolation between an FS (field shielding) electrode and a gate electrode (6), upper and lower major surfaces of a polysilicon layer (35) forming a principal part of an FS electrode (5) are covered with nitride films (SiN films) (34, 36) respectively. Therefore, it is possible to inhibit portions in the vicinity of edge portions of the polysilicon layer (35) from being oxidized by an oxidant following oxidation for forming a gate insulating film (14). Thus, the polysilicon layer (35) is inhibited from deformation following oxidation, whereby the distance between an FS electrode (5) and a gate electrode (6) is sufficiently ensured. Consequently, isolation between the FS electrode (5) and the gate electrode (6) is improved.

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