Method for thermally treating resist film and forming undercut p

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Processing feature prior to imaging

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430311, 430330, G03F 700

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active

054987695

ABSTRACT:
A method for thermally treating a resist film for forming an undercut pattern therein includes forming internally in the resist film a distribution of temperatures falling from the surface of the resist film toward an interface between the resist film and the substrate. The heat source and the resist film are brought to a state wherein they are located closely to each other while maintaining an untouching space. This state is kept for a predetermined time period, and the resist film and the heat source are caused to be spaced away from each other to a location wherein the resist film is free from being influenced by the heat source. Only by having a desired pattern exposed and subsequently developed, it is possible to form the resist pattern in an undercut form in the resist film which is useful as an underlying pattern in a lift-off process. Far-ultraviolet rays may be applied on an entire surface of the resist film after the developing process so as to enhance thermal resistance characteristics of the resist patter in the resist film.

REFERENCES:
patent: 5203958 (1993-04-01), Arai
patent: 5217834 (1993-06-01), Higaki

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