Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1999-06-03
2000-09-26
Dawson, Robert
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
524561, 524562, 524492, 524404, 524443, 524497, 257707, H01L 2302, B65C 920
Patent
active
06123799&
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The present invention relates to a heat-conductive pressure-sensitive adhesive excellent in the heat conductivity and the adhesive property, and in particular, showing a large adhesive force in a high temperature (heat resisting shear retention force), which is used for fixing electronic parts, particularly for fixing an electronic part and a heat-radiating member, and further for fixing other members in various fields such as building materials, vehicles, aircrafts, and ships.
BACKGROUND ART
Hitherto, in electronic parts such as hybrid packages, multimodules, and sealed-type integrated circuits with plastics or metals, with the increase of the integration of IC circuits, the heating value is increased and because there is a possibility of causing the malfunction of electronic parts by the increase of temperature, a countermeasure for preventing the occurrence of the malfunction by attaching a heat-radiating member such as a heat sink, to the electronic part has been taken.
As a method of attaching a heat-radiating member to an electronic part, a method of using an adhesive prepared by adding an aluminum powder to a composition containing a polymerizable acrylic acid ester monomer and a free radical initiator is known as disclosed in U.S. Pat. No. 4,722,960. However, in the method, it is necessary to carry out a heat treatment by using a primer or blocking oxygen after coating the above-described adhesive onto one or both of the electronic part and the heat-radiating member, a long time and much labor are required for the adhering treatment, and it is necessary to temporarily fix the adherend until the adhesive is cured. Thus, the method has a problem in poor production efficiency of electronic devices.
To avoid such a problem, a method of using a so-called heat-conductive pressure-sensitive adhesive having a heat conductivity and a pressure-sensitive adhesive property is known. In the method, the above-described heat-conductive pressure-sensitive adhesive is placed between an electronic part and a heat-radiating member and by utilizing the pressure-sensitive adhesive property, both the members are fixed by adhesion. Thus, the method does not essentially cause the problem of requiring a long time and much labor for the adhering treatment. However, it is considered that, for example, in a certain kind of commercially available heat-conductive pressure-sensitive adhesive tape, an acrylic polymer is used as the adhesive polymer thereof, but in such a heat-conductive pressure-sensitive adhesive tape, there is a difficulty that the pressure-sensitive adhesive tape does not show a good adhesive force to electronic parts and heat-radiating members which are made up of metals having a high polarity, which appears to be attributable to the monomer composition of the above-described acrylic polymer, and is inferior in the adhesive-fixing force between the electronic part and the heat-radiating member.
Also, as other heat-conductive pressure-sensitive adhesive tapes, a pressure-sensitive adhesive tape containing in the pressure-sensitive adhesive layer thereof silver particles having the particle sizes larger than the thickness of the layer (U.S. Pat. No. 4,606,962), a pressure-sensitive adhesive tape wherein heat-conductive electrically insulating particles are randomly dispersed in an acrylic polymer [JP-A-6-88061 (the term "JP-A" as used herein means an "unexamined published Japanese patent application), and EP-566093 A1], etc., are known. These pressure-sensitive adhesive tapes show a relatively good adhesive force to electronic parts having a high polarity but in these tapes, there are problems that the heat-conductive pressure-sensitive adhesive itself is inferior in the stability, that is, during or after the preparation of the pressure-sensitive adhesive, the viscosity thereof is extremely increase to loose the fluidity thereof, whereby the handling property, and, particularly, the coating workability becomes poor, and in the case of forming a pressure-sensitive adhesive tape, the accuracy
REFERENCES:
patent: 5213868 (1993-05-01), Liberty et al.
patent: 5298791 (1994-03-01), Liberty et al.
patent: 5502085 (1996-03-01), Ohura et al.
Handbook of Adhesives, 3rd Ed., edited by Skeist, Van Nostrand Reinhold, 1990.
Muta Shigeki
Ohura Masahiro
Yoshikawa Takao
Dawson Robert
Nitto Denko Corporation
Peng Kuo-Liang
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