Structure and method for corrosion and stress-resistant intercon

Details Structure and method for corrosion and stress-resistant intercon Structure and method for corrosion and stress-resistant intercon

1992-06-05

1993-11-30

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437189, 437193, 437200, H01L 2144

Patent

active

052665224

ABSTRACT:
This invention relates generally to structure and method for corrosion- and stress-resistant interconnecting metallurgy, and more specifically to new structures and methods for corrosion- and stress-resistant interconnecting multilayer metallurgical pad comprising sequentially deposited layers of chromium, nickel and noble or relatively noble metal as the interconnecting metallurgy, or multilayer metallurgical pad comprising sequentially deposited layers of chromium, soluble noble metal, nickel and noble or relatively noble metal as the interconnecting metallurgy. This invention also relates to an improved multilayer metallurgical pad or metallurgical structure for mating at least a portion of a pin or a connector or a wire to a substrate.

REFERENCES:
patent: Re27934 (1974-05-01), Merrin et al.
patent: 3977840 (1976-08-01), Estep et al.
patent: 4164607 (1979-08-01), Thiel et al.
patent: 4176443 (1979-12-01), Iannuzzi et al.
patent: 4463059 (1984-06-01), Bhattacharya et al.
patent: 4480261 (1984-10-01), Hattori et al.
patent: 4503131 (1985-03-01), Baudrand
patent: 4563399 (1986-01-01), Wright, Jr.
patent: 4634638 (1987-01-01), Ainslie et al.
patent: 4651191 (1987-03-01), Ooue et al.
patent: 4675243 (1987-06-01), Obinata et al.
patent: 4772523 (1988-09-01), Mace et al.
patent: 4880684 (1989-11-01), Boss et al.
patent: 4923827 (1990-05-01), Calviello et al.
patent: 4963512 (1990-10-01), Iwanaga et al.
patent: 4970570 (1990-11-01), Agarwala et al.
patent: 4983250 (1991-01-01), Pan
patent: 4985310 (1991-01-01), Agarwala et al.
patent: 5057454 (1991-10-01), Yoshida et al.
patent: 5059553 (1991-10-01), Berndlmainer et al.
patent: 5122477 (1992-06-01), Wolters et al.
"Backside Preparation and Metallization of Silicon Wafers for Die-Bonding," Research Disclosure, No. 267 (Jul. 1986).

Affiliated with

Also associated with

Rating

Structure and method for corrosion and stress-resistant intercon does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Structure and method for corrosion and stress-resistant intercon, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Structure and method for corrosion and stress-resistant intercon will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2095865