Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive...
Patent
1983-12-14
1986-04-08
Louie, Won H.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
430270, 430272, 430495, 430496, 430935, G03C 168
Patent
active
045813159
ABSTRACT:
Photographic and Photolithographic systems are provided which utilize diacetylenic materials as components thereof. Such materials, which include at least two acetylenic bonds in conjugation with one another, provide a combination of both high sensitivity and high resolving power, thus resulting in superior photographic and photolithographic properties.
In accordance with a preferred embodiment of the invention, a substrate is coated with at least one layer of a polymerizable composition comprising a diacetylenic species, said layer being organized into a plurality of domains having a substantially regular array of the diacetylenic species. In other embodiments, covalent bonding of the diacetylenic layer to the substrate is accomplished through the use of suitably constituted silane species, thus to provide a highly beneficial adhesion of substrate and photo- or photolithographic layer.
REFERENCES:
patent: 3811895 (1974-05-01), Ehrlich
patent: 3822134 (1974-07-01), Rasch
patent: 3911169 (1975-10-01), Lesaicherre
patent: 4168982 (1979-09-01), Pazos
"Synthesis of N-(nitrophenyl)amine Substituted Diacetylene Monomers", Garito et al., Makromolecular Chemie, (in press).
"The Quantum Yield of the Topochemical Photopolymerization of Diacetylenes in Multi-Layers", by Wegner et al., Makromolecular Chemistry, vol. 179, pp. 1639-1642 (1978).
"Mechanism of Adhesion Through Silane Coupling Agents", E. P. Plueddemann, Composite Materials, Brautman, Krock Eds., vol. 6, Ch. 6, Academy Press (1974).
"Polymerization of Diacetylenes in Multi-Layers", Wegner et al, Journal of Polymer Science, Polymer Chemistry Ed., vol. 17, pp. 1631-1644 (1979).
Louie Won H.
University Patents Inc.
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