Copper-base alloy cleaning solution

Details Copper-base alloy cleaning solution Copper-base alloy cleaning solution

1984-08-20

1986-04-08

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

134 3, 134 41, 156656, 156657, 156666, 156667, 252 793, C23F 100, B44C 122, C03C 1500, C03C 2506

Patent

active

045811024

ABSTRACT:
The present invention relates to a cleaning solution for removing surface oxides from copper base alloys without significantly etching the copper-base alloy material. The cleaning solution comprises from about 1 v/o to about 50 v/o hydrofluoric acid and from about 5 v/o to about 50 v/o of at least one of sulfuric acid and hydrochloric acid. In a preferred embodiment, the cleaning solution consists essentially of from about 5 v/o to about 15 v/o hydrofluoric acid and from about 25 v/o to about 50 v/o sulfuric acid and the balance essentially water.

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patent: 4220706 (1980-09-01), Spak
ASM Committee, "Cleaning and Finishing of Copper and Copper Alloys", Metals Handbook, 8th Edition, vol. 2, pp. 635-647.

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