Molding die used for sealing semiconductor chips with good produ

Details Molding die used for sealing semiconductor chips with good produ Molding die used for sealing semiconductor chips with good produ

1996-01-25

1998-04-21

Nguyen, Khanh P.

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

425117, 425572, 425588, 26427217, 2643288, B29C 4502, B29C 4514, B29C 4526

Patent

active

057415307

ABSTRACT:
A molding die has a plurality of cavity groups each occupying four corners of a rectangular area for accommodating semiconductor chips mounted on a lead-frame, pots each occupying a central area of the rectangular area and a plurality of runner groups each having straight runners equal in length and connecting the pot to the cavities in the four corners, and molten resin concurrently reaches the cavities in the four corners so as to produce semiconductor devices without non-filling or partially filling cavity.

REFERENCES:
patent: 5123826 (1992-06-01), Baird
patent: 5158780 (1992-10-01), Schrawen et al.
patent: 5204122 (1993-04-01), Konishi
patent: 5302101 (1994-04-01), Nishimura
patent: 5435953 (1995-07-01), Osada et al.

Affiliated with

Also associated with

Rating

Molding die used for sealing semiconductor chips with good produ does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Molding die used for sealing semiconductor chips with good produ, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Molding die used for sealing semiconductor chips with good produ will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2055500