Coating processes – Direct application of electrical – magnetic – wave – or... – Plasma
Patent
1998-06-02
1999-10-19
Pianalto, Bernard
Coating processes
Direct application of electrical, magnetic, wave, or...
Plasma
42724915, 42725529, 427255394, 427578, H05H 124
Patent
active
059686120
ABSTRACT:
The invention provides a method for preparing a silicon thin film at a high deposition rate or a silicon compound thin film having a high dielectric strength and high hardness, without causing damage to other structure films or forming flakes during film deposition. The method for preparing a silicon or silicon compound thin film involves evaporating a material by means of a high density plasma gun, and depositing a thin film of silicon or silicon compound on a substrate.
Arai Michio
Takayama Suguru
Pianalto Bernard
TDK Corporation
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