Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1991-07-30
1992-11-03
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156647, 156651, 156657, 1566591, 156662, 346140R, H01L 21306, B44C 122
Patent
active
051605775
ABSTRACT:
A method of fabricating an aperture plate for a roofshooter thermal ink jet printhead wherein a two step orientation dependent etch is conducted on a silicon wafer. The two step etch forms a trough in one face of the silicon wafer and a plurality of apertures in either the same or opposite face as the trough.
REFERENCES:
patent: 4169008 (1979-09-01), Kurth
patent: 4455192 (1984-06-01), Tamai
patent: 4789425 (1988-12-01), Drake et al.
patent: 4791440 (1988-12-01), Eldridge et al.
patent: 4914736 (1990-04-01), Matsuda
IBM Technical Disclosure Bulletin, vol. 19, No. 6, Nov. 1976, "Nozzle Arrays In Mesa Structures Etched In Single Crystal Silicon".
IBM Technical Disclosure Bulletin, vol. 22, No. 7, Dec. 1979, "Process For Fabricating Ink Jet Nozzles".
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