Precision diced aligning surfaces for devices such as ink jet pr

Details Precision diced aligning surfaces for devices such as ink jet pr Precision diced aligning surfaces for devices such as ink jet pr

1991-08-09

1992-11-03

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156645, 156647, 156657, 156662, 156257, 156258, 156264, 1563045, 437226, H01L 21306, H01L 2100, B32B 3100, B44C 122

Patent

active

051604035

ABSTRACT:
A method of fabricating a semiconductor device having a buttable edge from a first wafer having first and second opposite planar surfaces and a second wafer having first and second opposite planar surfaces is disclosed. A first component is formed on the first planar surface of the first wafer. A precision dice cut is placed in the first planar surface of the first wafer closely adjacent to the first component. The precision dice cut extends partially through the first surface of the first wafer and defines the buttable edge. The first surface of the first wafer is bonded to the first surface of the second wafer, the first surface of the second wafer containing a second component and being aligned with and bonded to the first wafer so that the first and second components cooperate to form the semiconductor device. Portions of the first and second wafers surrounding the first and second components, respectively, are then removed to define the semiconductor device. The step of removing can include placing a second dice cut entirely through the first and second wafers parallel to and slightly offset from the precision dice cut. The second dice cut being located slightly further away from the first component than the precision dice cut and intersects a portion of the precision dice cut so that a side of the semiconductor device which includes the buttable edge is defined by the precision dice cut and the second dice cut.

REFERENCES:
patent: 4786357 (1988-11-01), Campanelli et al.
patent: 4814296 (1989-04-01), Jedlicka et al.
patent: 4822755 (1989-04-01), Hawkins et al.
patent: 4829324 (1989-05-01), Drake et al.
patent: 4851371 (1989-07-01), Fisher et al.
patent: 4878992 (1989-11-01), Campanelli
patent: 5000811 (1991-03-01), Campanelli

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