Semiconductor device including combed bond pad opening, assembli

Details Semiconductor device including combed bond pad opening, assembli Semiconductor device including combed bond pad opening, assembli

1999-04-22

2000-07-18

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361767, 361748, 361764, 257678, 257684, 257778, 174262, 174260, 439629, 439638, H05K 702

Patent

active

060916060

ABSTRACT:
A semiconductor device including bond pads disposed proximate an edge thereof, and an overcoat layer. The overcoat layer defines notches around each of the bond pads. The overcoat layer may be formed from a photoimageable material such as a photoimageable epoxy. The invention also includes an alignment device that secures the semiconductor device perpendicularly upon a carrier substrate. The alignment device includes intermediate conductive elements which correspond to the bond pads of the semiconductor device. Upon insertion of the semiconductor device into the alignment device, the notches facilitate alignment of the bond pads with their corresponding intermediate conductive elements. The intermediate conductive elements establish an electrical connection between the semiconductor device and the carrier substrate.

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