Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1997-06-30
1998-12-22
Aftergut, Jeff H.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
1562755, 156275, 174 51, 174 521, 257675, 257712, 257720, 361712, 361714, 361720, B32B 3100
Patent
active
058513370
ABSTRACT:
A method for connecting TEHS to PBGA and a modified connecting structure for TEHS and PBGA are disclosed. The structure improves both heat dissipation efficiency of PBGA by TEHS with high heat conductivity and electrical performance of PBGA by TEHS which is electrically connected to the circuit in PBGA substrate. There are two methods of connecting TEHS to PBGA, including metallic soldering and nonmetallic adhesion. In the metallic soldering, the contact region of the TEHS is covered with a layer of solder tin and soldered to metallic contact region of the growing circuit in the substrate. In the nonmetallic adhesion, the metallic contact region of the growing circuit is covered with a layer of conductive resin. The TEHS is adhered and fixed to the metallic region by curing the conductive resin. Such two methods achieve that the TEHS is completely connected to the ground circuit in the substrate and the inductance of the whole device is reduced to decrease the noise which is generated by the inductance, and further to improve the quality of high speed transmission. Modified structures for soldering TEHS are also provided to reduce the concentration of stress.
REFERENCES:
patent: 3665256 (1972-05-01), Goun
patent: 4999136 (1991-03-01), Su et al.
patent: 5583377 (1996-12-01), Higgins III
Aftergut Jeff H.
Caesar Technology Inc.
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