Apparatus for chemical mechanical polishing

Details Apparatus for chemical mechanical polishing Apparatus for chemical mechanical polishing

1997-07-25

1998-12-22

Rose, Robert A.

Abrading

Precision device or process - or with condition responsive...

With indicating

451 6, 451 10, 451 41, 451288, B24B 4904

Patent

active

058511369

ABSTRACT:
A method and apparatus is disclosed for polishing the face of a semiconductor wafer. The wafer is held in position by a tooling head and is contacted by an abrasive pad. A table is provided on to which the abrasive pad is fixedly attached, both of which move in directions parallel to the face of the wafer being polished. A controller controls the motion of the table according to a predetermined polishing pattern and is capable of maintaining a constant velocity between the wafer and the abrasive pad. The tooling head includes a circular platen and a retention ring peripherally oriented about the outer edge of the platen which resists lateral forces on the wafer caused by engagement of the face of the wafer with the polishing surface. An adjustable coupling is mounted to the platen and the ring, and serves to adjustably position during polishing the height of the ring relative to the face of the wafer as well as to rigidly support during polishing the position of the retaining ring. A flexible disk is fixedly mounted between a support post and the platen and oriented substantially parallel to the face of the platen. The flexible disk is adapted to prevent rotation of the platen about the axis of the support post and to transmit forces between the platen and the post in directions parallel to the face of the platen.

REFERENCES:
patent: 1577137 (1926-03-01), Maynard
patent: 3518798 (1970-07-01), Boettcher
patent: 3667661 (1972-06-01), Farmer
patent: 3730410 (1973-05-01), Altshuler
patent: 3906678 (1975-09-01), Roth
patent: 4194324 (1980-03-01), Bonora et al.
patent: 4270314 (1981-06-01), Cesna
patent: 4282924 (1981-08-01), Faretra
patent: 4313284 (1982-02-01), Walsh
patent: 4344160 (1982-08-01), Gabriel et al.
patent: 4425038 (1984-01-01), La Fiandra et al.
patent: 4508161 (1985-04-01), Holden
patent: 4793895 (1988-12-01), Kaanta et al.
patent: 4811522 (1989-03-01), Gill, Jr.
patent: 4930262 (1990-06-01), Sennewald
patent: 4954142 (1990-09-01), Carr et al.
patent: 5036630 (1991-08-01), Kaanta et al.
patent: 5081795 (1992-01-01), Tanaka et al.
patent: 5193316 (1993-03-01), Olmstead
patent: 5205082 (1993-04-01), Shendon et al.
patent: 5230184 (1993-07-01), Bukham
patent: 5232875 (1993-08-01), Tuttle et al.
patent: 5234867 (1993-08-01), Schultz et al.
patent: 5267418 (1993-12-01), Currie et al.
patent: 5297361 (1994-03-01), Baldy et al.
patent: 5329732 (1994-07-01), Karlsrud et al.
patent: 5335453 (1994-08-01), Baldy et al.
patent: 5352249 (1994-10-01), Vollaro
patent: 5377451 (1995-01-01), Leoni et al.
patent: 5384986 (1995-01-01), Hirose et al.
patent: 5398459 (1995-03-01), Okumura et al.
patent: 5413941 (1995-05-01), Koos et al.
patent: 5476548 (1995-12-01), Lei et al.
patent: 5487697 (1996-01-01), Jensen
patent: 5582534 (1996-12-01), Shendon et al.
patent: 5584751 (1996-12-01), Kobayashi et al.
patent: 5609511 (1997-03-01), Moriyama et al.
patent: 5643048 (1997-07-01), Iyer
Dialog.RTM. English abstract of Japanese Patent Publication No. 63-62668 (Mar. 18, 1988). Two pages total.
Publication No.: 08153692 A and translation of Patent Abstracts of Japan, Publication No. 08153692-A.
Drawing figure labeled "Figure 6".

Affiliated with

Also associated with

Rating

Apparatus for chemical mechanical polishing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for chemical mechanical polishing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for chemical mechanical polishing will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2040819