Semiconductor chip-substrate attachment structure

Details Semiconductor chip-substrate attachment structure Semiconductor chip-substrate attachment structure

1998-08-17

2000-07-18

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438106, 438119, 438122, H01L 2144, H01L 2148, H01L 2150

Patent

active

06090643&

ABSTRACT:
A semiconductor device soldered to a conical mounting pedestal of a metal substrate reduces the lateral shearing stress created by temperature changes. An angle between the bonding surfaces of the semiconductor device and the metal substrate can be selected as a function of the coefficients of thermal expansion of the device and substrate material.

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Paper--SA 100 Series--Surge Arrestors .COPYRGT. 1994 SGS--Thomson Microelectronics.
"Double Pedestal Cell Outline," Drawing No. 4101537; Apr. 22, 1991 (Teccor).
"Cell Outline," Drawing No. 4101055; Aug. 13, 1987 (Teccor).

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