4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Including adhesive bonding step

Teccor Electronics, L.P.

Corporate Assignee

Rate now
  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Corporate Assignee

active

No affiliations

Semiconductor chip-substrate attachment structure

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Single side contacts for a semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Regenerative type switching device – Device protection
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Very low voltage actuated thyristor with centrally-located...

Active solid-state devices (e.g. – transistors – solid-state diode – Regenerative type switching device – Having only two terminals and no control electrode – e.g.,...
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Teccor Electronics, L.P. does not yet have a rating. At this time, there are no reviews or comments for this inventor.

If you have personal experience with Teccor Electronics, L.P., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Teccor Electronics, L.P. will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-P-1807575

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.

Canada

 Charities
 Companies
 MP Candidates
 Patents
 Employee Salary Disclosure

World

 Places of the World
 Scientific Papers

United States

 Banks
 Companies
 Counties
 Patents
 Employee Salary Disclosure