Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1982-09-24
1984-05-01
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29576W, 29580, 148187, 156651, 156653, 156657, 1566611, 357 49, 427 88, 430313, H01L 21306, H01L 21312, B44C 122, C03C 1500
Patent
active
044459670
ABSTRACT:
The invention provides a method for manufacturing a semiconductor device, comprising the steps of: forming a mask material pattern at least on a portion of a semiconductor layer which corresponds to a prospective element formation region; etching the semiconductor layer, using the mask material pattern, to form a first groove which is wide and shallow; burying a first isolating material in the first groove to a thickness substantially equal to the depth of the first groove; etching a portion of the first isolating material film which is located in the vicinity of the prospective element formation region to partially expose a bottom of the first groove, thereby forming a second groove which is narrower than said first groove, a position of the second groove being defined by the mask material pattern; forming a third groove which is deeper than said first and second grooves by etching a bottom of the second groove; and burying a second isolating material in the third groove.
REFERENCES:
IBM Technical Disclosure Bulletin, vol. 19, No. 12 (May 1977), Minimizing "Bird's Beak" When Forming Recessed Dielectric Isolation by I. Antipov, pp. 4596-4597.
"A New Bird's-Beak Free Field Isolation Technology for Vlsi Devices", K. Kurosawa et al., IEDM Dig. Tech. Papers, pp. 384-387 (1981).
Powell William A.
Tokyo Shibaura Denki Kabushiki Kaisha
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