Method of manufacturing platinum temperature sensor

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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1566591, 156664, 156901, 29620, 20419232, C23F 100, B44C 122

Patent

active

052445364

ABSTRACT:
A method of manufacturing a platinum temperature sensor includes the step of obtaining a meandering resistive circuit by forming grooves in a platinum film which is provided on an insulating substrate. In order to provide a high resistance value by reducing the line width of the resistive circuit, as well as to miniaturize the platinum temperature sensor, this method comprises steps of forming a resist film on the platinum film provided on the insulating substrate, patterning the resist film by photolithography, and using the patterned resist film as a mask to finely work the platinum film by Ar.sup.+ ion etching for forming the grooves. Due to formation of such grooves, the platinum film defines a meandering pattern portion which provides the resistive circuit.

REFERENCES:
patent: 4248688 (1981-03-01), Gartner et al.
patent: 4624138 (1986-11-01), Ono et al.
patent: 4805296 (1989-02-01), Jinda et al.

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