Process for forming bonding pads on magnetic bubble devices

Details Process for forming bonding pads on magnetic bubble devices Process for forming bonding pads on magnetic bubble devices

1979-04-06

1980-10-21

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

134 34, 156643, 156657, 156668, 365 29, 357 27, B44C 122, B29C 1708, C03C 1500, C03C 2506

Patent

active

042292484

ABSTRACT:
A process for thickening the relatively thin bonding pads of a single wall magnetic domain (bubble) device is disclosed. The process is particularly suited for thickening the pads defined by a buried metal layer, such as the conductive layer often disposed between the magnet garnet layer and permalloy layer. Windows are etched through a polyimide scratch protection layer to expose underlying bonding pads. A layer of gold is formed over this protective layer and over the exposed pads. The gold layer is washed away from the protective layer. Since the gold adheres only to the bonding pads, it remains to build up the thickness of these pads.

REFERENCES:
patent: 3740819 (1973-06-01), Babusci et al.
patent: 3858304 (1975-01-01), Leedy et al.
patent: 3863333 (1975-02-01), Loya
patent: 3957552 (1976-05-01), Ahn et al.
patent: 3959047 (1976-05-01), Alberts et al.
patent: 4057659 (1977-11-01), Pammer et al.

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