Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent
1998-04-16
2000-08-15
Clark, Sheila V.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
257676, 257777, H01L 2348, H01L 2352, H01L 2940
Patent
active
061040843
ABSTRACT:
An insulation material and a wire pattern are provided on at least one of the surfaces of a die pad. Wires of the wire pattern are patterned in such a manner that at least one inner lead included in at least one of two lead groups is electrically connected to an electrode pad provided on the element forming surface of the semiconductor chip near the side edge other than the side edge opposing the lead group including the above particular inner lead, while at least one inner lead included in the other lead group is electrically connected to an electrode pad provided on the element forming surface of the semiconductor chip near the side edge other than the side edge opposing the other lead group. Accordingly, a multichip-1-package semiconductor device using any kind of semiconductor chip can be realized. Also, the costs of the semiconductor device are saved and the semiconductor device can be developed in a shorter period by omitting the design modification of the semiconductor chip.
REFERENCES:
patent: 5646829 (1997-07-01), Sota
patent: 5719436 (1998-02-01), Kuhn
patent: 5724233 (1998-03-01), Honda et al.
patent: 5780926 (1998-07-01), Seo
patent: 5793108 (1998-08-01), Nakanishi et al.
patent: 5804874 (1998-09-01), An et al.
Ishio Toshiya
Maruyama Tomoyo
Mori Katsunobu
Nakanishi Hiroyuki
Tarui Katsuyuki
Clark Sheila V.
Sharp Kabushiki Kaisha
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