Method of fabricating a high performance interconnect system for

Details Method of fabricating a high performance interconnect system for Method of fabricating a high performance interconnect system for

1990-05-18

1991-03-19

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156644, 156646, 156653, 156657, 1566591, 156663, 437192, 437195, 437199, 437203, 437228, B44C 122, C23F 102, C03C 1500, C03C 2506

Patent

active

050008188

ABSTRACT:
A semiconductor integrated circuit device includes a high performance interconnect structure which comprises a plurality of interconnects, with each interconnect being structurally separated from the remaining interconnects except at electrical contact points. In one embodiment, each interconnect is substantially surrounded by a layer of dielectric material, there being gaps between each adjacent layer of surrounding dielectric material. Another embodiment, a layer of electrically conductive material is formed over the surrounding dielectric layer preferably filling in the gaps between adjacent layers of surrounding dielectric material. The layer of electrically conductive material acts as a ground plane and heat sink.

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