Thin-film transistor and method of manufacturing the same

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

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438158, 438763, H01L 2100, H01L 2131

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active

061035564

ABSTRACT:
A thin-film transistor (3, 5a, 5b and 5c) is covered with a first silicon nitride film (9) formed by an LPCVD method. A first silicon oxide film (6) is formed on the first silicon nitride film (9). A silicon nitride film (7), i.e., passivation film which is formed by a plasma CVD method is provided on the first silicon oxide film (6).

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H. Kitajima et al., "Leakage Current Reduction in Sub-Micron Channel Poly-Si TFT's", Extended Abstracts of the 1991 International Conference on Solid State Devices and Materials, Yokohama, Aug. 27-19, 1991, pp. 174-176.
Peter J. Wright et al., "The Effect of Fluorine in Silicon Dioxide Gate Dielectrics", IEEE Transaction on Electron Devices, vol. 36, No. 5, May 1989, pp. 879-889.
S. Maeda et al., "Negative Bias Temperature Instability in Poly-Si TFT's", 1993 VLSI Symposium, pp. 29-30, Month Unknown.
Kousuke Okuyama et al., "Water-Related Threshold Voltage Instability of Polysilicon TFT's", Okuyama et al., IEDM 93, pp. 527-530.
S. M. Sze, VLSI Technology Second Edition, 1988, pp. 261-263, Month Unknown .

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