Specular machining apparatus for peripheral edge portion of wafe

Details Specular machining apparatus for peripheral edge portion of wafe Specular machining apparatus for peripheral edge portion of wafe

1988-09-13

1992-03-24

Kisliuk, Bruce M.

Abrasive tool making process, material, or composition

With carbohydrate or reaction product thereof

51 42, 51 80R, 51 89, 51105R, 51106R, 51215HM, 51237R, B24B 500, B24B 4702

Patent

active

050976303

ABSTRACT:
A specular machining apparatus for giving a specular machining or mirror-like surface to a peripheral edge portion, in particular a chamfered portion, of typically a semiconductor wafer such as a silicon wafer. This mirror-like surface is provided to smooth out the relatively rough surface formed by etching to remove a strained layer which is generated as a result of grinding work. The mirror-like surface tends to reject the attachment of dirt, which is desirable. The specular machining apparatus is of simple construction and easy to use, comprising a chuck table plus chuck means for holding a wafer having a chamfered peripheral edge portion. The chuck table rotates the wafer held by the chuck about the wafer axis. A polishing ring is disposed to be freely rotatable around an axis perpendicular to the axis of the wafer on the chuck table, to permit the polishing surface on the outer periphery to be accessable for polishing.

REFERENCES:
patent: 3943666 (1976-03-01), Dion et al.
patent: 4262452 (1981-04-01), Lopez
patent: 4417422 (1983-11-01), Redeker
patent: 4453347 (1984-06-01), Redeker
patent: 4753049 (1988-06-01), Mori

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