Method for controlling semiconductor wafer processing

Details Method for controlling semiconductor wafer processing Method for controlling semiconductor wafer processing

1995-06-07

1997-08-26

Ramirez, Ellis B.

Boots, shoes, and leggings

364151, 364578, 36446828, 20419213, 427 10, G05B 1304

Patent

active

056616694

ABSTRACT:
A system (10) for run-to-run control of semiconductor wafer processing is provided. An input/output device (12) receives a desired quality characteristic for a particular semiconductor fabrication process. A generating circuit (22) uses a model to generate appropriate process parameters for a processing unit (20) and an expected quality characteristic. An adjusting circuit (16) functions to adjust process parameter inputs of the processing unit (20). In-situ sensor (18) functions to measure a quality characteristic of the process in the processing unit (20) on a real-time basis. A comparing circuit (24) functions to compare the measured quality characteristic with the expected quality characteristic. A model adjusting circuit (26) may adjust the model of the generating circuit (22) if the measured quality characteristic varies from the expected quality characteristic by more than a predetermined statistical amount.

REFERENCES:
patent: 5347460 (1994-09-01), Gifford et al.
patent: 5408405 (1995-04-01), Mozumder et al.
patent: 5526293 (1996-06-01), Mozumder et al.
B. Bombay and C.J. Spanos, Application of Adaptive Equipment Models to a Photolithographic Process, In SPIE Proceedings: Process Module Metrology, Control and Clustering, vol. 1594, pp. 277-284, California, Sep. 1991.

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