Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1995-11-03
1997-08-26
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257719, 257724, 257732, 361710, 361719, H01L 2334, H01L 2312
Patent
active
056613423
ABSTRACT:
A resin molded type semiconductor device having a structure, by which a semiconductor element can be accurately positioned on the heat sink and simultaneously a scrubbing operation is performed on the semiconductor element. This resin molded type semiconductor device has a heat sink, a semiconductor element fixed to the heat sink with a thermal conductive adhesive agent, an electrode electrically connected to the semiconductor element, a plurality of projections on the heat sink, and a sealing resin sealing the heat sink, the semiconductor element, and the electrode. The plurality of projections are used for positioning the semiconductor element and are loosely in contact with at least two sides of the semiconductor element on the heat sink.
REFERENCES:
patent: 3626259 (1971-12-01), Garboushian
patent: 4339768 (1982-07-01), Keller et al.
patent: 4888307 (1989-12-01), Spairisano et al.
patent: 4950427 (1990-08-01), Endo
patent: 5309027 (1994-05-01), Letterman, Jr.
patent: 5311060 (1994-05-01), Rostoker et al.
Mitsubishi Denki & Kabushiki Kaisha
Ostrowski David
Thomas Tom
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