Plurality of photolithographic alignment marks with shape, size

Details Plurality of photolithographic alignment marks with shape, size Plurality of photolithographic alignment marks with shape, size

1995-06-01

1997-12-30

Breneman, R. Bruce

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

1566621, 437225, 437228, 437924, H01L 23544

Patent

active

057025673

ABSTRACT:
Photolithographic alignment marks (e.g., mask and measurement overlay marks) are formed of a pattern of very small marks using the design configuration and rule of a circuit pattern feature. A relatively large mark comprising a pattern of small marks modeled after the circuit pattern feature results in an etch rate within the mark area that is substantially the same as the etch rate in the circuit pattern (e.g., cell or peripheral circuit) area. This allows for simultaneous formation of circuit pattern features, and the alignment marks, in a common etching step, while avoiding underetching (shallow etch depth) due to a microloading effect. In this manner, proper formation of readily detectible marks is ensured.

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