Semiconductor device having plural air gaps for decreasing paras

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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257900, 438422, 438595, H01L 2978

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active

061277118

ABSTRACT:
A method of manufacturing a semiconductor device includes the step of forming a gate electrode on a semiconductor substrate via a gate insulating film and the step of forming a first insulating film on side surfaces of the gate electrode and an upper surface of the semiconductor substrate. Also the method includes the step of forming a second insulating film on the first insulating film and the step of etching back the first and second insulating films to form side walls of the gate electrode each of which includes layers of the first and second insulating films. The method includes the step of etching the first insulating films of the side walls to remain a part of the first insulating film layers.

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Togo, et al. "A Gate-side Air-gap Structure (GAS) to Reduce the Parasitic Capacitance in MOSFETs", 1996 Symposium on VSLI Technology Digest of Technical Papers,pp. 38-39, 1996.

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