Method for making beam leads for ceramic substrates

Details Method for making beam leads for ceramic substrates Method for making beam leads for ceramic substrates

1976-04-02

1977-05-10

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29589, 29630R, 156247, 156289, 156656, 156645, 156665, 156666, 427177, 427259, 427282, 427284, 427287, C23F 102

Patent

active

040226417

ABSTRACT:
A method for making beam leads for use in the interconnecting of electronic evices and packages. A first metal is deposited onto a substrate which has poor adhesion with the substrate. A portion of the deposited metal is then etched away leaving on said substrate deposited metal at locations where a second metal is not to adhere to the substrate. Then depositing onto said substrate and over said first deposited metal a plurality of beam leads of a second metal. Then lifting said portions of said first metal from said substrate and then etching away said first metal to provide beam leads partially attached to said substrate.

REFERENCES:
patent: 3322655 (1967-05-01), Garibotti et al.
patent: 3487541 (1970-01-01), Boswell
patent: 3691290 (1972-09-01), Napier

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