Ringfield lithography

Details Ringfield lithography Ringfield lithography

1991-07-19

1994-05-24

Church, Craig E.

X-ray or gamma ray systems or devices

Specific application

Lithography

378 85, G21K 500

Patent

active

053156293

ABSTRACT:
Ringfield projection apparatus using x-ray radiation e.g. of 1.30 .ANG. wavelength is suitable for lithographic patterning in the fabrication of integrated circuits at design rules of 0.25 .mu.m and below. The design permits reduction from an enlarged mask as well as substantial throughput, the latter due to unexpectedly large slit width. Incorporation of a folding mirror improves fabrication expediency by moving the device being fabricated to the other side of the system from the mask.

REFERENCES:
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patent: 4733955 (1988-03-01), Cook
patent: 4747678 (1988-05-01), Shafer
patent: 5063586 (1991-11-01), Jewell et al.
patent: 5153898 (1992-10-01), Suzuki et al.
J. Vac. Sci. Technology, Kinoshita et al., "Soft X-Ray Reduction Lithography Using Multilayer Mirrors", vol. B6, p. 1648 (1989).
J. Vac. Sci. Technology, Hawryluk and Seppala, "Soft X-Ray Projection Using an X-Ray Reduction Camera", vol. B6, p. 2161 (1988).
Proc. of 33rd Int. Symp. on Electron, Ion, and Photon Beams, Wood et al., "Short Wavelength Annular-Field Optical Systems for Imaging Tenth Micron Features", (1989).
J. Vac. Sci. Technology, Bjorkholm et al., "Reduction Imaging at 14 nm Using Multilayer Coated Optics: Printing of Features Smaller Than 0.1 mm", B8 (6), (Nov./Dec. 1990).
Proceedings of SPIE, "Resist Schemes for Soft X-Ray Lithography", vol. 1343, (1990).
Solid State Technology, D. L. White et al., "Soft X-Ray Projection Lithography", (Jul. 1991).

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