Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Patent
1992-07-13
1994-05-24
Hille, Rolf
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Entirely of metal except for feedthrough
257706, H01L 2302, H01L 2312
Patent
active
053151550
ABSTRACT:
There is provided an electronic package assembly having a leadframe and buffer bonded to a metallic base. To reduce the stress generated by the coefficient of thermal expansion mismatch, the buffer is mounted on a pedestal. The cross sectional area of the pedestal is less than that of the buffer, such that the at least a portion of the buffer overhangs the pedestal.
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Crane Jacob
Mahulikar Deepak
Mravic Brian
O'Donnelly Brian E.
Clark S. V.
Hille Rolf
Olin Corporation
Rosenblatt Gregory S.
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