Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent
1992-03-20
1994-05-24
Nguyen, Nam
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
20419212, 20429819, 2042982, C23C 1434
Patent
active
053145976
ABSTRACT:
A rotatable magnet configuration for use in a magnetron sputtering system for obtaining a desired sputter target erosion profile and for obtaining a sputtered film on a substrate having a desired film characteristic, such as uniformity of thickness, and a method of designing such a magnet configuration are disclosed. The disclosed design and method compensate for the discrepancy between the between the actual position of the magnet and the "effective" position of the magnet as measured by a static erosion profile obtained holding the magnet stationary. The method shown describes how to adjust the actual shape of the magnet to obtain a desired effective shape that will produce a predetermined erosion profile in the sputter target. In addition, the disclosure describes how to determine an optimal erosion profile to produce a sputtered film having a desired characteristic.
REFERENCES:
patent: 4444643 (1984-04-01), Garrett
patent: 4606806 (1986-08-01), Helmer
patent: 4872964 (1989-10-01), Suzuki et al.
patent: 4995958 (1991-02-01), Anderson et al.
Nguyen Nam
Varian Associates Inc.
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