Reduced pressure processing system and reduced pressure processi

Details Reduced pressure processing system and reduced pressure processi Reduced pressure processing system and reduced pressure processi

1992-05-28

1994-05-24

McFarlane, Anthony

Coating apparatus

Gas or vapor deposition

With treating means

118 50, 118724, 118733, C23C 1600

Patent

active

053145410

ABSTRACT:
A reduced pressure processing system includes a load lock chamber having an opening communicating with a process atmosphere in which a wafer is processed and/or the outer air atmosphere, a gate valve which is arranged at the opening to close/open the chamber with respect to the process atmosphere and/or the outer air atmosphere, a robot for loading/unloading the wafer into/from the chamber, an evacuation pump for evacuating the chamber, a heater for heating the wall of the chamber, and a controller for controlling the gate valve, the robot, the evacuation pump, and the heater.

REFERENCES:
patent: 4640223 (1987-02-01), Dozier
patent: 4680061 (1987-07-01), Lamont, Jr.
patent: 4839145 (1989-06-01), Gale et al.
patent: 5044314 (1991-09-01), McNeilly
patent: 5121705 (1992-06-01), Sugino
patent: 5182231 (1993-01-01), Hengo et al.

Affiliated with

Also associated with

Rating

Reduced pressure processing system and reduced pressure processi does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Reduced pressure processing system and reduced pressure processi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reduced pressure processing system and reduced pressure processi will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1970517