Interposer array module for capacitive decoupling and filtering

Details Interposer array module for capacitive decoupling and filtering Interposer array module for capacitive decoupling and filtering

1999-09-14

2000-10-24

Hardy, David

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

257734, 257691, 257701, H01L 2302, H01L 2352, H01L 23053

Patent

active

061371610

ABSTRACT:
A semiconductor package includes a circuit chip which presents electrical contacts configured and aligned for attachment to corresponding contacts on a supporting substrate. The semiconductor package further includes an interposer with upper surface contacts aligned with the circuit chip contacts and lower surface contacts aligned with the corresponding contacts on the supporting substrate. The interposer includes a series of ground plane layers which are capacitively coupled to the conductors that connect the upper surface contacts to the lower surface contacts. The ground plane layers closest to the circuit chip have plates therebetween and electrically separated therefrom which are connected to the power input supply lines to form decoupling capacitances. The ground plane layers more remote from the circuit chip have, therebetween and electrically separated therefrom, conductive flange portions attached to individual signal lines to form a low pass feed through filter for each signal line. The capacitance of the flange portions is designed to establish the correct roll off to pass the desired signals and shunt to ground the unwanted harmonics while the decoupling capacitance is sized to afford the required, stabilized power supply. The semiconductor package also may include a conductive shield member that surrounds the top and four sides of the package and is connected to the grounded elements of the interposer to provide mechanical connection and apply ground potential to the shield.

REFERENCES:
patent: 4812949 (1989-03-01), Fontan et al.
patent: 5016087 (1991-05-01), Haug et al.
patent: 5177594 (1993-01-01), Chance et al.
patent: 5369545 (1994-11-01), Bhattacharyya et al.
patent: 5371403 (1994-12-01), Huang et al.
patent: 5668399 (1997-09-01), Cronin et al.
patent: 5790384 (1998-08-01), Ahmad et al.
patent: 5841686 (1998-11-01), Chu et al.

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