Thermal processing apparatus

Details Thermal processing apparatus Thermal processing apparatus

1997-03-24

1998-05-26

Walberg, Teresa J.

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

219390, 219158, 392418, 414148, 414161, 118728, F27B 128, F27B 518

Patent

active

057569649

ABSTRACT:
A thermal processing apparatus for processing a wafer is disclosed. The thermal processing apparatus includes a thermal processing plate, a plurality of spacers, a plurality of locators, and a plurality of sensors. The temperature of the thermal processing plate is controlled within a predetermined range. The spacers are arranged over the thermal processing plate for supporting the wafer, thereby forming a gap between the wafer and the thermal processing plate. The locators, each of which is disposed over one of the spacers, are provided for locating the wafer. The sensors, each of which is disposed over one of the locators, are provided for detecting the position of the wafer.

REFERENCES:
patent: 4008815 (1977-02-01), Fisk
patent: 5436790 (1995-07-01), Blake et al.
patent: 5670066 (1997-09-01), Barnes et al.

Affiliated with

Also associated with

Rating

Thermal processing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal processing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal processing apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1963677